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Waste electrical and electronics (WEEE) contain metals, glass, and plastics in association with several hazardous materials. WEEE processing usually involves dismantling the discarded equipments followed by sorting and segregation of different components such as glass, large plastics, metal composites and other special parts and reusable units. Segregated scraps are subjected to comminution for effective liberation of constituent metals from the associated nonmetallic materials. Physical beneficiation methods such as gravity, magnetic and electrostatic separation are generally employed to separate light weight fractions, and ferrous and non-ferrous metals. Metallic concentrate can further be subjected to hydrometallurgical treatment for the extraction and recovery of metals. In this review, current status of treatment of waste printed circuit boards (PCBs) and recycling technologies in practice are presented. The problems encountered in the existing recycling processes are particularly discussed. A processing approach involving application of inexpensive and eco-friendly unit operations based on the physical beneficiation for complete recycling and resource utilization of all materials with high efficiency for waste PCBs is highlighted and discussed in brief.
폐전기・전자기기는 다양한 유해물질과 함께 금속, 유리 그리고 플라스틱 등을 함유하고 있다. 일반적으로 폐전기・전자기기의 처리는 폐기된 제품의 부품들을 분해하고, 유리, 부피가 큰 플라스틱, 금속 복합체 등과 같은 물질 및 특수한 부품과 재사용이 가능한 부품으로 선별하여 분리하는 것을 포함한다. 분리된 스크랩들은 금속성분과 비금속성분의 효율적인 단체분리를 위하여 분쇄된다. 비중, 자력 및 정전선별 등과 같은 물리적 선별이 가벼운 물질, 철 그리고 비철성분들을 분리하기 위하여 적용된다. 금속성분의 농축물로부터 금속의 회수를 위하여 습식제련법으로 처리될 수 있다. 본 고에서는 폐전기・전자기기로 부터 배출되는 폐인쇄회로기판의 현재 처리 상황과 재활용공정 기술을 제시한다. 뿐만 아니라 현재 폐인쇄회로기판의 재활용 공정에서 발생되는 문제점들에 대해서도 논의될 것이다. 끝으로 새롭게 연구되고 있는 환경친화적이면서 고효율적인 폐인쇄회로기판을 자원화하는 공정을 제시하고 설명할 것이다.
- Bahadir Basdere and Seliger Guenther, 2003, Disassembly Factories for Electrical and Electronic Products to Recover Resources in Product and Material Cycles. Environmental Science & Technology, Vol. 37, pp. 5354-5362.
- BAN and SVTC. 2002, “xporting Harm: The High-Tech Trashing of Asia,”Seattle and San Jose: Basel Action Network and Silicon Valley Toxics Coalition, February 25, Available: http://www.ban.org/E-waste/technotrashfinalcomp.pdf
- Boks C., Tempelman E., 1998, “uture Disassembly and Recycling Technology- Results of a Delphi Study,”Futures Vol. 30, pp. 425-442.
- Brandl H., Bosshard R., Wegman M., 2001, “omputermunching microbes: metal leaching from electroninc scrap by bacteria and fungi,”Hydrometallurgy, Vol. 59, pp. 319-326.
- Burke M., 2007, “he gadget scrap heap” Chem World UK, Vol. 4, pp. 45-48.
- Cui J., Zhang L., 2008, “etallurgical recovery of metals from electronic waste: a review,”J. Hazard. Mater. Vol. 158, pp. 228-256.
- Dalmijn W.L., Van Houwelingen J.A., 1995, “ew developments in the processing of the non-ferrous metal fraction of car scrap,”in: P.B. Queneau, R.D. Peterson (Eds.), in: Proceedings of the Third International Symposium on Recycling of Metals and Engineered Materials, Point Clear, TMS, Warrendale, USA, pp. 739-750.
- Dalmijn W.L., Van Houwelingen J.A., 1996, “lass recycling in The Netherlands,”Glass, Vol. 73, p. 3.
- Das A., Vidyadhar A., Mehrotra S.P., 2009, “ novel flowsheet for the recovery of metal value from waste printed circuit boards,”Resource, Conservation and Recycling, Vol. 53, pp. 464-469.
- EEA, 2003, Waste from electrical and electronic equipmentquantities, dangerous substances and treatment methods.
- European Topic Center on Waste. European Environmental Agency (EEA).
- European Commission, 2000, “raft proposal for a European parliament and council directive on waste electric and electronic equipment, Brussels, Belgium,”http://www.eia.org/download/eic/21/www Final Proposal June 2000.htm, 2000- 07-31.
- Forssberg E., Cui J., 2003, “echanical recycling of waste electric and electronic equipment: a review,”Journal of Hazardous Materials, Vol. 99, pp. 243-63.
- Fuerstenau M.C., Han K. N., 2003, “rinciples of mineral processing, Society for Mining, Metallurgy, and Exploration,” Inc. (SME), Colorado, USA, ISBN: 0-87335-167-3.
- Gesing A.J., Reno D., Grisier R., Dalton R., Wolanski R., 1998, “on-ferrous metal recovery from auto shredder residue using eddy current separators,”in: Proceedings of the TMS Annual Meeting, San Antonio, TMS, America Ships Electronic Waste Overseas By Terence Chea, Associated Press, 11/18.
- Hartmut Harbeck, 2001, “ptoelectronic separation in feldspar processing at Maffei Sarda,”Aufbereitungs-Technik, Vol. 42, p. 438.
- Higashiyama Y., Asano K., “998, Recent progress in electrostatic separation technology,”Particul. Sci. Technol. Vol. 16, pp. 77-90.
- Hoberg H., 1993, “pplications of mineral processing in waste treatment and scrap recycling,”in: Proceedings of the XVIII International Mineral Processing Congress, Sydney, Australia, Australasian Institute of Mining & Metallurgy, Parkville, Australia, 1993, p. 27.
- Huang K., Guo J., Xu Z., 2009, “ecycling of waste printed circuit boards: A review of current technologies and treatment status in China,”Journal of Hazardous Materials, Vol. 164, pp. 399-408.
- Kaley K. B., Carlisle J., Siegel D., Salinas J., 2006, “ealth Concerns and Environmental Issues with PVC-Containing Building Materials in Green Buildings (pdf),”Integrated Waste Management Board, California Environmental Protection Agency, USA, p.11. Retrieved on 2007-08-03.
- Kang H.Y., Schoenung J.M., 2005, “lectronic waste recycling: a review of U.S. infrastructure and technology options,” Resources, Conservation and Recycling, Vol. 45, pp. 368-400.
- Kattentidt H.U.R., De Jong T.P.R., Dalmijn W.L., 2003, “ulti-sensor identification and sorting of bulk solids,” Control Engineering Practice, Vol. 11, pp. 41-47.
- Kim E.Y., Kim M.S., Lee J.-c., Jeong J., Kim B.S., 2006, “eaching of copper from waste printed circuit boards using electro-generated chlorine in hydrochloric acid solution” In: Howard SM, et al., editors. EPD congress 2006.
- Proceedings of sessions and symposia sponsored by the extraction and processing division (EPD) of TMS. Warrendale: TMS; pp. 929-33.
- Koyanaka Shigeki and Kobayashi Kenichiro, 2010, “utomatic sorting of light weight metal scrap by sensing apparent density and three-dimensional shape,”Resources, Conservation and Recycling, Vol. 54, pp. 571-578.
- Langerak E., 1997, “o Shred or To Disassemble? Recycling of Plastics in Mass Consumer Goods,”Proceedings of the 1997 5th IEEE International Symposium on Electronics and the Environment, ISEE, San Francisco, CA, USA, 63-68.
- Lee C.H., Chang C.T., Fan K.S., Chang T.C, 1997, “n overview of recycling and treatment of scrap computers,” Journal of Hazardous Materials, Vol. 114, pp. 93-100.
- Lee J. -c., 2006, “evelopment of total recycling technology for waste electric and electronic equipment,”Final report on Resource Recycling R&D Program, 2CA- 1-1, KIGAM, Daejeon, Korea (in Korean).
- Lee J. -c., Koyanaka S., Lee M., Ohya H., Endoh S., 1997, “ecovery of copper, tin and lead from the spent printed circuit boards (PCBs) by the shape separation method Shigen-to-Sozai,”Journal of the Mining and Materials Processing Institute of Japan, Vol. 113, pp. 357-362.
- Lee J.-c., Song H. T., Yoo J.M., 2007, Review Present status of the recycling of waste electrical and electronic equipment in Korea. Resources, Conservation and Recycling Vol. 50, pp. 380-397.
- Lee J-c., Kim D.J., 2004, “evelopment of technology for recovering valuable metals from industrial wastes in KIGAM,”In: Product recovery and impurity control. I: pure products from clean processing. Proceedings of the Parker Center hydrometallurgy conference 2004.
- Lehner T., 2003, “&HS aspects on metal recovery from electronic scrap,”in: Proceedings of the IEEE International Symposium on Electronics and the Environment, pp. 318-322.
- Mathieu G.I., Provencher R., Tellier J.G., 1990, “echanical sorting of aluminum metal from spent pot lining,”in: Proceedings of the 119th TMS Annual Meeting, Anaheim, TMS, Warrendale, USA, pp. 361-367.
- Matsuto T., Jung C.H., Tanaka N., 2004, “aterial and Heavy Metal Balance in a Recycling Facility for Home Electrical Appliances,”Waste Management, Vol. 24, pp. 425-436.
- Meier-Staude R., Koehnlechner R., 2000, “lektrostatische trennung von leiter/nichtleitergemischen in der betrieblichen praxis (electrostatic separation of conductor/non-conductor mixtures in operational practice),”Aufbereitungs-Technik, Vol. 41, pp. 118-123.
- Menad N., Bjorkman B., Allain E.G., 1998, “ombustion of plastics contained in electric and electronic scrap,” Resources, Conservation and Recycling, Vol. 24, pp. 65-85.
- Meyer M., 1995, “evelopment and realization of shredder fluff recycling,”in: P.B. Queneau, R.D. Peterson (Eds.), in: Proceedings of the Third International Symposium on Recycling of Metals and Engineered Materials, Point Clear, TMS, Warrendale, USA, pp. 765-776.
- Murthy D. S. R., Kumar V., Rao K. V., 2003, “xtraction of gold from an Indian low grade refractory gold ore through physical beneficiation and thiourea leaching,” Hydrometallurgy, Vol. 68, Issues 1-3, pp. 125-130.
- Murthy D.S.R. and Kumar Vinod, 2002, “ process for the recovery of gold and silver from the used refractory bricks of the Dore furnace,”Patent Application No.: PCT/1N02/00068, Dated 26-3-2002 (USA).
- Nnorom I.C., Ohakwe J., Osibanjo O., 2009, “urvey of willingness of residents to participate in electronic waste recycling in Nigeria –A case study of mobile phone recycling,”Journal of Cleaner Production, Vol. 17, pp. 1629-1637.
- Norrgran D.A., Wernham J.A. 1991, “ecycling and secondary recovery applications using an Eddy-current separator,” Miner. Metal. Proc. Vol. 8, pp. 184-187.
- Pilone and Kelsall, 2006, “rediction and measurement of multi metal electrodeposition rates and efficienecies in aqueous acidic chloride media,”Electrochemica Acta, Vol. 51, p. 3803.
- Rath R.K. and Singh R., 2010, “rocessing of E-Waste with a particular reference to the role of physical separation technique,”Proceedings of the National Seminar on Electronic Waste. Eds: R.Singh, A.Das, K.K. Bhattacharyya and N.G. Goswami@ NML Jamshedpur, India, pp. 90-108.
- Rem P.C., Zhang S., Forssberg E., and Jong T.P.R.D., 2000, “he investigation on separability of particles smaller than 5 mm by eddy current separation technology - Part II: Novel design concepts,”Magnetic and Electrical Separation, Vol. 10, pp. 85-105.
- Rohwerder T., Gehrke T., Kinzler K., Sand W., 2003, “rogress in bioleaching: Fundamentals and mechanisms of bacterial metal sulfide oxidation,”J.Appl. Microbiol. Biotechnol. Vol. 63, pp. 239-248.
- Rossi G., 1990, Biohydrometallurgy, McGraw –Hill, Hamburg, New York. Schäfer T., Looy E. V., Weingart A., Pretz T., 2003, “utomatic separation devices in mechanical recycling processes,”International Electronics Recycling Congress, January 13-15, Basel, Switzerland.
- Schubert H., Wirbelstromsortierung Grundlagen, Scheider Gnwendungen, 1994, “ddy current separation-foundations, separators, application,”Aufbereitungs-Technik, Vol.35, pp. 553-562.
- Schubert H.G., Warlitz G., 1994, “orting metal/non-metal mixtures using a corona electrostatic separator,”Aufbereitungs-Technik, Vol. 35, pp. 449-456.
- Schubert, G., 1991, “ufbereitung der NE-Metallschrotte und NE-metallhaltigen Abfaelle - teil 1 (Processing of Scrap and Refuse Containing Non-ferrous Metals –Part 1),”Aufbereitungs-Technik, Vol. 32, p. 78.
- Sötemann J., 2000, “rocessing of baryte and fluorsparseparation of complex raw ores with increasing quality standards,”Aufbereitungs-Technik, Vol. 41, p. 271.
- Stahl I., Beier P.-M., 1997, “orting of plastics using the electrostatic separation process,” in: H. Hoberg, H. Von Blottnitz (Eds.), in: Proceedings of the XX International Mineral Processing Congress, Vol. 5, Aachen, GDMB, Clausthal-Zellerfeld, Germany, pp. 395-401.
- Stuart J. A., Christina V., 2003, “ew Metrics and Scheduling Rules for Disassembly and Bulk Recycling,”IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, pp. 133-140.
- Torres F., Gil P., Puente S. T., Pomares J., Aracil R., 2004, “utomatic PC Disassembly for Component Recovery,” International Journal of Advanced Manufacturing Technology, Vol. 23, pp. 39-46.
- Van Der Valk H.J.L., Braam B.C., Dalmijn W.L., 1982, “ddy-current separation by permanent magnets Part I. Theory,”Resour. Conserv. Vol. 12, pp. 233-252.
- Veldbuizen H., Sippel B., 1994, “ining discarded electronics,” J. Ind. Environ. Vol. 17, pp. 7.
- Venugopal R., 2010, “rocessing of wastes for utilizationthe road trodden and the path ahead,”Proceedings of the National Seminar on Electronic Waste. Eds: R.Singh, A.Das, K.K. Bhattacharyya and N.G. Goswami@ NML Jamshedpur, India, pp. 187-195.
- Viet H. M., Diehl T. R. Salami, A. P., Rodrigues J. S., Bernardes, A.M., Tenorio J.A.S., 2005, “tilization of magnetic and electrostatic separation in the recycling of printed circuit board scrap,”Waste Management, Vol. 25, pp. 67-74.
- Williams J., 2006, “ review of electronic demanufacturing processes” Resources, Conservation and Recycling, Vol. 47, pp. 195-208.
- Williams P., Hall W., 2007, “eparation and recovery of materials from scrap printed circuit boards,”Resour. Conserv. Recycl. Vol. 51, pp. 691-709.
- Wills B. A., 1998, Mineral Processing Technology, 4th edn., Pergamon Press, Oxford, England, pp. 377-381.
- Wilson R.J., Veasey T.J., Squires D.M.,1994, “pplication of mineral processing techniques for the recovery of metal from post-consumer wastes,”Miner. Engg. Vol. 7, pp. 975-984.
- Xiuying G., Dong X., Guanghong D., Peng M., 2010, “review of mechanochemistry applications in waste management,” Waste Management, Vol. 30, pp. 4-10.
- Yokoyama S., Iji M., 1997, “ethod of recovering valuable substances from printed circuit boards,”U.S. Patent No. 5,676,318 October 14, 1997.
- Yoo J.M., Jeong J., Yoo K., Lee J-c., Kim W., 2009, “nrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill,”Waste Management, Vol. 29, pp. 1132-1137.
- Zhang S., and Forssberg E., 1997, “lectronic Scrap Characterization for Materials Recycling,”Journal of Waste Management & Resource Recovery, Vol. 3, pp. 157-167.
- Zhang S., Forssberg E., 1998, “ptimisation of electrodynamic separation for metals recovery from electronic scrap,” Resources, Conservations and Recycling, Vol. 22, pp. 143-62.
- Zhang S., Forssberg E.,1999, “ntelligent liberation and classification of electronic scrap” Powder Technology, Vol. 105, pp. 295-301.
- Zhang S., Forssberg E., 1997, “echanical separation-oriented characterization of electronic scrap,”Resour. Conserv. Recycle, Vol. 21, pp. 247-269.
- Zhang S., Rem P.C., Forssberg E., 1999, “nvestigation of separability of particles smaller than 5 mm by eddy current separation technology Part I: rotating type eddy current separators,”Magnetic and Electric Separation, Vol. 9, pp. 233-251.
- Zheng Su, Wang Yun-yan and Chai, Li-yuan, 2006, “esearch status and prospect of gold leaching in alkaline thiourea solution,”Mineral Engineering, Vol. 19, pp. 1301-1306.
- Publisher :The Korean Society of Mineral and Energy Resources Engineers
- Publisher(Ko) :한국자원공학회
- Journal Title :Journal of the Korean Society for Geosystem Engineering
- Journal Title(Ko) :한국지구시스템공학회지
- Volume : 47
- No :5
- Pages :593-608


Journal of the Korean Society of Mineral and Energy Resources Engineers







